Thomas Zerbs, Technical Marketing Engineer, Adaptive and Embedded Computing Group at AMD presents “Accelerating Deep Learning Models on AMD Adaptive SoCs with the AMD Vitis AI Workflow” at the May 2026 Embedded Vision Summit. In this presentation, we provide a practical end-to-end overview of the AMD Vitis™ AI workflow for… “Accelerating Deep Learning Models on […]
This blog post was originally published at Samsung Semiconductor’s website. It is reprinted here with the permission of Samsung Semiconductor. Artificial Intelligence (AI) is rapidly expanding beyond digital environments and into the physical world. AI-driven systems that give machines the ability to perceive, comprehend, learn from, and respond to real-time environments are quickly moving from
Samsung Foundry and Cadence: Accelerating Chiplet Solutions for Physical AI Read More +
Key Takeaways: Addresses a critical challenge in AI – delivering high-density, energy-efficient compute as power and thermal demands limit system scale Further advances ADI’s position as a leading strategic, system-level grid-to-core power partner for hyperscalers and AI silicon developers Expands ADI’s total addressable market in AI compute power delivery with Integrated Voltage Regulator (IVR) and
Live demos showcasing high-accuracy ALPR, AI-powered traffic analytics, and cloud-based traffic video management solutions for Vision Zero initiatives California & Chennai (May 27, 2026): e-con Systems®, a global leader in embedded vision solutions, will showcase its latest Edge AI-powered Intelligent Transportation System (ITS) solutions at ITS America Conference & Expo 2026, taking place from
Alok Gupta, Senior Technical Marketing Manager at AMD presents “Accelerating Physical AI with ROCm: High-Performance ML on AMD Embedded iGPUs” at the May 2026 Embedded Vision Summit. Discover how AMD’s ROCm software stack unlocks data center-class ML performance on embedded integrated GPUs, enabling diverse AI workloads from CNNs and transformers… “Accelerating Physical AI with ROCm:
LETTER FROM THE EDITOR Dear Colleague, This month’s Embedded Vision Summit was a resounding success, with more than a thousand attendees learning from nearly a hundred presenters and hundreds of demos, as well as making valuable connections. 2026 Embedded Vision Summit presentation videos and slide decks will become available on the Edge AI and
Edge AI and Vision Insights: May 27, 2026 Read More +
This blog post was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. The story of EV adoption contains a warning that semiconductor companies would be wise to take seriously. When the automotive industry made the leap from combustion engines to electric drivetrains, it discovered that a transformative technology is not enough on its own. The
By integrating a CPU, GPU, and NPU, Intel Core Ultra Series 3 delivers edge AI power across global use cases—from hospitality and manufacturing to healthcare and education. At 2 a.m., an emergency room nurse orders a latte at a quiet hospital coffee stand. There is no human behind the counter. Instead, a sleek robotic arm
Intel Core Ultra Series 3: The New Standard for Edge AI Robotics Compute Read More +
Pietro Antonio Cicalese, Senior Technical Marketing Engineer at Ambarella, presents “Edge-First Coding Agents: Trustworthy Agentic Development for Real Devices” at the May 2026 Embedded Vision Summit. Coding agents are usually built as cloud-first abstractions. But for developing trustworthy, production-ready edge systems, we’ve found that coding agents should be designed from… “Edge-First Coding Agents: Trustworthy Agentic
This blog post was originally published at Axelera AI’s website. It is reprinted here with the permission of Axelera AI. At a Glance The Achievement: Real-time AI person-of-interest (POI) identification and threat detection across multiple 8K streams at 2.5 PetaOPS The Stack: Voyager SDK + Axelera Metis + Intel Xeon The Future: 3x performance leap with
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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