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Yole Group Forecasts Automotive Semiconductor Market Will Double to $160 Billion by 2031

Automotive, News, Processors, Yole Group /

Yole Group has released Automotive Semiconductor Trends 2026, a new market report examining how electrification, advanced driver-assistance systems, centralized computing and software-defined vehicle architectures are reshaping the automotive semiconductor industry. Yole forecasts that the market will more than double from $77 billion in 2025 to $160 billion in 2031, representing a compound annual growth rate […]

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Synetic Demonstration of the LYNX SDK Beta: Real-Time CV Across Six Platforms in One Call

Algorithms & Models, Summit 2026, Synetic AI, Videos /

David Scott, CEO & Founder at Synetic, demonstrates the LYNX SDK beta release at the 2026 Embedded Vision Summit. LYNX returns detection, segmentation, depth, and keypoints simultaneously from a single forward pass, eliminating the need to chain multiple models on constrained edge hardware. David highlights several capabilities shipping in the beta: 3D positioning from a

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Synetic Demonstration of the LYNX Computer Vision SDK and Synthetic Data as a Service Platform

Algorithms & Models, Summit 2026, Synetic AI, Tools, Videos /

Will Ruffalo, Co-Founder at Synetic, introduces two of the company’s core offerings at the 2026 Embedded Vision Summit: the LYNX computer vision SDK and Synetic’s synthetic data as a service platform. LYNX delivers detection, segmentation, keypoints, and depth in a single inference call, across six platforms, from a single model artifact. Will also demonstrates how

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Edge AI and Vision Insights: August 5, 2026

Edge AI and Vision Alliance, Newsletters /

  LETTER FROM THE EDITOR Dear Colleague, This week’s issue highlights an edge AI ecosystem advancing on every front—from new processors, cameras and firmware to software platforms and industry consolidation. We also explore deploying GenAI, implementing voice and multimodal workloads on device, and integrating cameras, radar and computing into automotive physical AI. With both the

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What Quality Managers Get Wrong Before a Single Camera is Installed

Blog Posts, Industrial Vision (Computer Vision), Lincode /

This blog post was originally published at Lincode’s website. It is reprinted here with the permission of Lincode. The pilot looked great. Detection rates were strong, the demo impressed leadership, and the vendor was confident. Then it hit real production. Variable lighting, inconsistent line speeds, legacy equipment that wouldn’t talk to modern software, and operators who

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OpenMV Demonstration of Python-Programmable AI Vision with the N6, AE3, and OpenMV IDE

OpenMV, Sensors and Cameras, Summit 2026, Videos /

Kwabena Agyeman, President of OpenMV, demonstrates the company’s latest embedded AI vision technologies and products at the 2026 Embedded Vision Summit. Specifically, Agyeman showcases the OpenMV IDE’s live camera tuning and machine vision development workflow, along with the new OpenMV N6 and OpenMV AE3 AI camera modules. The demonstration highlights how developers can rapidly build,

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Working Group Previews MIPI Specification for I/Os Over I3C Bridge

Blog Posts, MIPI Alliance, Sensors and Cameras /

This blog post was originally published at MIPI Alliance’s website. It is reprinted here with the permission of MIPI Alliance. At the recent MIPI Alliance Member Meeting in Berlin, members of the MIPI I/O Bridges Working Group shared a demo of the forthcoming MIPI Specification for I/Os Over I3C Bridge, expected to be released later this

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Andes Technology Unveils Next-Generation AI Solutions: AndesAIRE AnDLA I370 v2.0 and NN SDK v1.2.0 for Advanced ViT, VLM, and SLM at the Edge

Andes Technology, News, Processors, Tools, VLMs /

Hsinchu, Taiwan – August 3, 2026 – Andes Technology, a leading supplier of high-performance, low-power 32/64-bit RISC-V processor cores and AI acceleration solutions, and a Founding Premier member of RISC-V International, proudly announces a major, synchronized evolutionary leap in its AI portfolio: the launch of the AndesAIRE™ AnDLA™ I370 v2.0 Deep Learning Accelerator IP and the

Andes Technology Unveils Next-Generation AI Solutions: AndesAIRE AnDLA I370 v2.0 and NN SDK v1.2.0 for Advanced ViT, VLM, and SLM at the Edge Read More +

NovaEyeD: Real-Time Face Recognition on ST’s STM32N6

Algorithms & Models, Processors, STMicroelectronics, Summit 2026, Videos /

See NovaEyeD in action — ModelNova™’s production-ready Edge AI face recognition model — demonstrated live at the STMicroelectronics booth during the 2026 Embedded Vision Summit. In this demo, we walk through how NovaEyeD delivers efficient, real-time face recognition directly on ST’s STM32N6 MCU, helping ST customers maximize the potential of their silicon. See what makes

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STMicroelectronics’ 3D direct ToF lidar module demo + Human detection application

Sensors and Cameras, STMicroelectronics, Summit 2026, Videos /

Experience a live demonstration of the VL53L9CX, STMicroelectronics’ advanced 3D direct ToF lidar module, showcased at Embedded Vision. Delivering up to 2.3k zones and real-time streaming at up to 100 Hz, the system captures highly detailed depth data with strong accuracy from short range up to nearly 9 meters. This all-in-one module integrates SPAD sensing,

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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PO Box #4446
Walnut Creek, CA 94596

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