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Edge AI and Vision Insights: July 8, 2026

  LETTER FROM THE EDITOR Dear Colleague, This week we’re looking at how edge AI and vision development is becoming more productive, more scalable and more accessible across real-world applications. Two upcoming webinars explore important pieces of this evolution: using edge-first coding agents to accelerate development for real devices, and making computer vision easier to […]

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Beyond the Bench: The Hard Truth About Robotics Automation in Logistics with Pickle Robotics

This video was originally published by Peridio. It is reprinted here with the permission of Peridio. In this episode of Beyond the Bench from Peridio, Bill Brock sits down with Ari Eisenstein, co-founder and CTO of Pickle Robotics. They discuss the evolution of robotics and AI, focusing on Pickle’s innovative approach to logistics automation. Ari

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Vedya Labs Demonstration of Stable Diffusion Deployment on Cadence Tensilica DSPs

Suresh Pasupuleti, Managing Director of Vedya Labs, presents the company’s work in bringing Stable Diffusion-based image generation to DSP-centric embedded platforms. The demonstration showcases a nearly 500-million-parameter model running on the Axera AX650N SoC, with the text encoder, U-Net, and VAE stages optimized for dual Cadence Tensilica Vision DSPs. Using INT8 quantization and a combination

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Bolom Sound Classification on Cadence Tensilica HiFi 5

Mauricio Greene of Bolom demonstrates real-time Sound Classification running on the Cadence Tensilica HiFi 5 DSP at the Embedded Vision Summit. Bolom Acoustic Intelligence edge models identify hundreds of distinct sound events and soundscape scenes – such as sirens, alarms, horns, traffic and more, fully on-device and without relying on the cloud. The Tensilica HiFi

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When the Edge Is 400 Kilometers Up: AI, Space, and the Limits of Cloud Computing

This blog post was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. The orbital community has reached the same conclusions that the broader edge AI industry has been articulating for years: If moving the data is more expensive than moving the result, the processing belongs where the data was produced. The

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BrainChip Announces Commercial Availability and Production Shipments of AKD1500 Neuromorphic Processors

Production quantities are currently shipping to customers as the chip undergoes comprehensive industrial and military-grade qualification.   LAGUNA HILLS, Calif. – June 30, 2026 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based neuromorphic AI technology, today announced the commercial availability and initial production

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Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes

Key Takeaways: World’s first independent APV HW IP ‘WAVE-P’ confirmed for flagship devices of a major North American client Following the Samsung-Qualcomm alliance, Chips&Media and North American Big Tech solidify APV as the industry standard Targeting the professional video market with 8K 120fps high-quality recording and editing optimization Seoul, South Korea July 2, 2026 –

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Pulling Back the Curtain on a Smarter, More Connected AI Future

At the 2026 Embedded Vision Summit, Boston AI CEO Peter Winston explores the latest advances shaping the future of AI. From intelligent agents to next-generation edge applications, he highlights how AI is evolving beyond task automation to become a more capable and collaborative partner within organizations. The video concludes with a look at emerging trends

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Insight Mirror: The mirror that sees you. The mirror that knows you. The mirror that talks back.

  At the 2026 Embedded Vision Summit, Dan Daoguru shows an interactive, AI-aware smart mirror designed to redefine customer engagement. The Insight Mirror is not just a reflection; it is a fully integrated, intelligent AI companion capable of dynamic, voice-first conversations, open-vocabulary visual recognition, and presence-aware engagement. Built around a single high-performance C++20 application and

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HTEC White Paper Outlines the Convergence of Edge AI, Semiconductor Software, and Autonomous Systems

This content was originally published at HTEC’s website. It is reprinted here with the permission of HTEC. Physical AI at the Edge: Building the Full Stack for Real-World Deployment For years, AI progress was measured by model benchmark scores. The real test is different: does it work when deployed in a vehicle, a factory, a

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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