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Now Available – Design-in Samples of the Basler boost Camera and Basler CXP-12 Interface Card

The new CoaXPress 2.0 (CXP-12) evaluation kits are now ready for orders. The kit consists of a Basler boost camera, the corresponding Basler CXP-12 interface card and the CXP-12 accessory starter kit for a faster and less expensive evaluation phase. For the activation, the pylon Camera Software Suite is an impressive SDK for the camera […]

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“The Xilinx AI Engine: High Performance with Future-proof Architecture Adaptability,” a Presentation from Xilinx

Nick Ni, Director of Product Marketing at Xilinx, presents the “Xilinx AI Engine: High Performance with Future-proof Architecture Adaptability” tutorial at the May 2019 Embedded Vision Summit. AI inference demands orders- of-magnitude more compute capacity than what today’s SoCs offer. At the same time, neural network topologies are changing too quickly to be addressed by

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“Designing Your Next Vision Product Using a Systems Approach,” a Presentation from Teknique

Ben Bodley, CEO of Teknique, presents the “Designing Your Next Vision Product Using a Systems Approach,” tutorial at the May 2019 Embedded Vision Summit. Today it’s easier than ever to create a credible demo of a new smart camera product for a specific application. But the distance from a demo to a robust product is

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Embedded Vision Insights: August 27, 2019 Edition

LETTER FROM THE EDITOR Dear Colleague, Are you interested in learning more about key trends driving the proliferation of visual AI? The Embedded Vision Alliance will deliver a free webinar on this topic on October 16. Jeff Bier, founder of the Alliance and co-founder and President of BDTI, will examine the four most important trends

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“Efficient Deployment of Quantized ML Models at the Edge Using Snapdragon SoCs,” a Presentation from Qualcomm

Felix Baum, Director of Product Management for AI Software at Qualcomm, presents the “Efficient Deployment of Quantized ML Models at the Edge Using Snapdragon SoCs” tutorial at the May 2019 Embedded Vision Summit. Increasingly, machine learning models are being deployed at the edge, and these models are getting bigger. As a result, we are hitting

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Huawei Launches Ascend 910, the World’s Most Powerful AI Processor, and MindSpore, an All-scenario AI Computing Framework

Eric Xu: We promised a full-stack, all-scenario AI portfolio. And today we delivered. [Shenzhen, China, August 23, 2019] Huawei officially launched the world's most powerful AI processor – the Ascend 910 – as well as an all-scenario AI computing framework, MindSpore. "We have been making steady progress since we announced our AI strategy in October

Huawei Launches Ascend 910, the World’s Most Powerful AI Processor, and MindSpore, an All-scenario AI Computing Framework Read More +

“Using Blockchain to Create Trusted Embedded Vision Systems,” a Presentation from Basler

Thies Möller, Technical Architect at Basler, presents the “Using Blockchain to Create Trusted Embedded Vision Systems” tutorial at the May 2019 Embedded Vision Summit. In many IoT architectures, sensor data must be passed to cloud services for further processing. Traditionally, “trusted third parties” have been used to secure this data. In this talk, Möller explores

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“Tools and Techniques for Optimizing DNNs on Arm-based Processors with Au-Zone’s DeepView ML Toolkit,” a Presentation from Au-Zone Technologies

Sébastien Taylor, Vision Technology Architect at Au-Zone Technologies, presents the “Tools and Techniques for Optimizing DNNs on Arm-based Processors with Au-Zone’s DeepView ML Toolkit” tutorial at the May 2019 Embedded Vision Summit. In this presentation, Taylor describes methods and tools for developing, profiling and optimizing neural network solutions for deployment on Arm MCUs, CPUs and

“Tools and Techniques for Optimizing DNNs on Arm-based Processors with Au-Zone’s DeepView ML Toolkit,” a Presentation from Au-Zone Technologies Read More +

Morpho Wins Award from the Embedded Vision Alliance – Video Now Available

August 21, 2019 – Morpho announces the availability of a video recorded at the 2019 Embedded Vision Summit held May 20-23, 2019 at the Santa Clara Convention Center. At the Summit, the Embedded Vision Alliance, a worldwide industry partnership bringing together technology providers and end-product companies who are enabling innovative and practical applications for computer

Morpho Wins Award from the Embedded Vision Alliance – Video Now Available Read More +

“REAL3 Time of Flight: A New Differentiator for Mobile Phones,” a Presentation from Infineon Technologies

Walter Bell, 3D Imaging Application Engineer at Infineon Technologies, presents the “REAL3 Time of Flight: A New Differentiator for Mobile Phones” tutorial at the May 2019 Embedded Vision Summit. In 2019, 3D imaging has become mainstream in mobile phone cameras. What started in 2016 with the first two smartphones using an Infineon 3D time-of-flight (ToF)

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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