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Intel Launches Core Series 2 Processor with Real-Time Performance and Expands Edge AI Portfolio

Intel, News, Processors /

New industrial-ready platform delivers breakthrough deterministic performance; sixth Edge AI suite targets healthcare applications   NUREMBERG, Germany — March 9, 2026 — At Embedded World 2026, Intel launched the Intel® Core™ processor Series 2 with P-cores, an industrial-ready platform engineered for mission-critical edge applications. Intel also announced its latest Edge AI suite for Health & Life Sciences, providing validated reference pipelines and benchmarking tools […]

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Synaptics Introduces SYN765x, an Industry-Leading AI-Native Wi-Fi® 7 Solution for Integrated IoT Edge Applications

Consumer, Industrial Vision (Computer Vision), News, Processors, Synaptics /

AN JOSE, Calif., Mar 10, 2026 — Synaptics Incorporated (Nasdaq: SYNA), today announced the SYN765x, an AI-native wireless solution that redefines Edge intelligence. As an industry-leading single-chip device combining AI-optimized compute with integrated Wi-Fi® 7, the SYN765x is designed to bring scalable, real-time intelligence directly to smart appliances, home automation systems, and Industrial IoT (IIoT) applications. SYN765x

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RTOS vs. Bare-Metal: Decision Matrix Tool for Projects Based on High-End Microcontrollers

Blog Posts, eInfochips, Processors, Software /

This blog post was originally published at eInfochips’ website. It is reprinted here with the permission of eInfochips. Introduction When building a system with a powerful microcontroller (MCU) or microprocessor, such as an ARM Cortex-M4, M7, R5, RXv3, A15, or A53—one of the key decisions developers face is whether to use bare-metal programming or a

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NXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI

News, NXP Semiconductors, Processors /

Key Takeaways: First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement Pre-certified designs simplify wireless certification, eliminating RF complexity and speeding time-to-market

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Conversations at the Edge with NXP

Au-Zone Technologies, NXP Semiconductors, Processors, Robotics, Sensors and Cameras, Software, Tools, Videos /

This blog post was originally published at Au-Zone’s website. It is reprinted here with the permission of Au-Zone. Are Single-Sensor Robots Obsolete? We think so, and we’re here to show you why. Au-Zone is proud to be featured in NXP Semiconductors’ Conversations at the Edge video series, a multi-part collaboration exploring innovation at the intersection of

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TI Accelerates the Next Generation of Physical AI with NVIDIA

D3 Embedded, News, NVIDIA, Processors, Robotics, Sensors and Cameras, Texas Instruments /

News highlights: TI and NVIDIA are collaborating to accelerate the path from simulation to the safe deployment of humanoid robots in the real world. As part of this collaboration, TI integrated its mmWave radar technology with NVIDIA Jetson Thor and NVIDIA Holoscan to enable low-latency 3D perception and safety awareness for physical AI applications. TI

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ModelCat AI Announces AI Model Portability Across Silicon Devices

Algorithms & Models, ModelCat, News /

An industry first, ModelCat’s Agentic AI generates models for new chips using a user’s current production models, dramatically accelerating inferencing to the edge. SUNNYVALE, Calif., March 5, 2026 /PRNewswire/ — ModelCat, the creator of the world’s first fully autonomous AI model builder, today announced its latest innovative platform capability: Model Retargeting (Patent Pending). Using Model Retargeting, ModelCat customers gain model

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STM32U3B5/U3C5: Bringing High-Performance DSP & Edge AI to Ultralow Power Designs

News, Processors, STMicroelectronics /

Built on the Arm® Cortex®‑M33 core, the STM32U3B5/U3C5 MCUs combine up to 2 Mbytes of dual‑bank flash memory with 640 Kbytes of RAM and are available in packages from 48 to 144 pins (UFQFPN, WLCSP, LQFP, and UFBGA). The lines introduce a hardware signal processor (HSP) to the STM32U3 portfolio, offloading complex DSP and edge‑AI workloads and

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From ADAS to Robotaxi: How Vision Systems Must Level Up to Meet New Mobility Use Cases (Part 2)

Automotive, Blog Posts, e-con Systems, Processors /

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Key Takeaways How urban lighting and motion define robotaxi imaging needs Which camera features support reliable perception during day and night operation Why unified AI vision boxes reduce latency and coordination gaps How integrated vision platforms

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Accelerating Product Development in the Era of Physical AI

Peridio, Software, Videos /

This video was originally published at Peridio’s website. It is reprinted here with the permission of Peridio. The embedded world is undergoing its biggest transformation in a generation. AI workloads are now moving into the physical world — into cameras, robots, tractors, and drones — and edge devices are evolving into intelligent agents. Yet the

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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