Processors

“Image Signal Processing Optimization for Object Detection,” a Presentation from Nextchip

Young-Jun Yoo, Executive Vice President at Nextchip, presents the “Image Signal Processing Optimization for Object Detection” tutorial at the May 2024 Embedded Vision Summit. This talk delves into the challenges and optimization strategies in image signal processing (ISP) for enhancing object detection in advanced driver-assistance systems (ADAS). Through real-world examples, Yoo explores the critical role […]

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“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America

Hussein Osman, Segment Marketing Director at Lattice Semiconductor, and Richard Crisp, Vice President and Chief Scientist at Etron Technology America, co-presents the “Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs” tutorial at the May 2024 Embedded Vision Summit. Attaining the lowest power, size and cost for a

“Squeezing the Last Milliwatt and Cubic Millimeter from Smart Cameras Using the Latest FPGAs and DRAMs,” a Presentation from Lattice Semiconductor and Etron Technology America Read More +

Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024

Cadence verification and RTL-to-GDS digital full-flow tuned for automotive safety, quality and reliability requirements 18 Jun 2024 – At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence® Tensilica® Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence® Verification

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TOPS of the Class: Decoding AI Performance on RTX AI PCs and Workstations

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. What is a token? Why is batch size important? And how do they help determine how fast AI computes? Editor’s note: This post is part of the AI Decoded series, which demystifies AI by making the technology

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“Maximize Your AI Compatibility with Flexible Pre- and Post-processing,” a Presentation from Flex Logix

Jayson Bethurem, Vice President of Marketing and Business Development at Flex Logix, presents the “Maximize Your AI Compatibility with Flexible Pre- and Post-processing” tutorial at the May 2024 Embedded Vision Summit. At a time when IC fabrication costs are skyrocketing and applications have increased in complexity, it is important to minimize design risks and maximize

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“Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors,” a Presentation from Cadence

Amol Borkar, Product Marketing Director at Cadence, presents the “Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors” tutorial at the May 2024 Embedded Vision Summit. From ADAS to autonomous vehicles to smartphones, the number and variety of sensors used in edge devices is increasing: radar, LiDAR, time-of-flight sensors and multiple cameras are

“Addressing Tomorrow’s Sensor Fusion and Processing Needs with Cadence’s Newest Processors,” a Presentation from Cadence Read More +

“Temporal Event Neural Networks: A More Efficient Alternative to the Transformer,” a Presentation from BrainChip

Chris Jones, Director of Product Management at BrainChip, presents the “Temporal Event Neural Networks: A More Efficient Alternative to the Transformer” tutorial at the May 2024 Embedded Vision Summit. The expansion of AI services necessitates enhanced computational capabilities on edge devices. Temporal Event Neural Networks (TENNs), developed by BrainChip, represent a novel and highly efficient

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How Edge Devices Can Help Mitigate the Global Environmental Cost of Generative AI

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Exploring the role of edge devices in reducing energy consumption and promoting sustainability in AI systems The economic value of generative artificial intelligence (AI) to the world is immense. Research from McKinsey estimates that generative AI could add the

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“Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!),” a Presentation from BDTI

Phil Lapsley, Co-founder and Vice President of BDTI, presents the “Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!)” tutorial at the May 2024 Embedded Vision Summit. For over 30 years, BDTI has provided engineering, evaluation and advisory services to processor suppliers and companies that use processors in products.

“Silicon Slip-ups: The Ten Most Common Errors Processor Suppliers Make (Number Four Will Amaze You!),” a Presentation from BDTI Read More +

“How Axelera AI Uses Digital Compute-in-memory to Deliver Fast and Energy-efficient Computer Vision,” a Presentation from Axelera AI

Bram Verhoef, Head of Machine Learning at Axelera AI, presents the “How Axelera AI Uses Digital Compute-in-memory to Deliver Fast and Energy-efficient Computer Vision” tutorial at the May 2024 Embedded Vision Summit. As artificial intelligence inference transitions from cloud environments to edge locations, computer vision applications achieve heightened responsiveness, reliability and privacy. This migration, however,

“How Axelera AI Uses Digital Compute-in-memory to Deliver Fast and Energy-efficient Computer Vision,” a Presentation from Axelera AI Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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