Brian Dipert

Accelerating Generative AI At the Edge

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Advanced techniques powering fast, efficient and accurate on-device generative AI models As generative artificial intelligence (AI) adoption grows at record-setting speeds and computing demands increase, on-device AI processing is more important than ever. At MWC 2023, we

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DEEPX Making High-performance, Low-power AI Servers a Reality with DX-H1 Launch at CES 2024

The award-winning AI booster achieves over 10 times power-to-performance efficiency compared to GPUs LAS VEGAS, Dec. 20, 2023 /PRNewswire/ — DEEPX (CEO, Lokwon Kim), an original AI semiconductor technology company, is set to make waves at CES 2024 by introducing the DX-H1 — a cutting-edge PCIe card designed to accelerate AI server performance while reducing

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What’s In the Box? In-cabin Monitoring Systems At a Glance

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Twice a month, Yole SystemPlus analysts share noteworthy points from their automotive Teardown Tracks. Today, they take us to the heart of imaging-based occupant and driver monitoring systems (OMS and DMS). Already

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What’s In the Box? Automotive LiDARs At a Glance

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Twice a month, Yole SystemPlus analysts share the noteworthy points from their automotive Teardown Tracks. Today, Benjamin Pussat, Technology & Cost Analyst at Yole SystemPlus, takes us to the heart of LiDAR

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What’s In the Box? Automotive Radars At a Glance

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. 3D waveguide antenna technology constitutes a revolution. Twice a month, Yole SystemPlus analysts share the noteworthy points from their automotive Teardown Tracks. Today, Baptiste Desbois, Guillaume Robichon, Maël Fontaine, Stéphane Elisabeth, Technology

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What’s In the Box? Driver Monitoring Systems in Chinese Cars At a Glance

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. DMS rely on a simple optical architecture, low resolution and old CIS technologies Twice a month, Yole SystemPlus analysts share the noteworthy points from their automotive Teardown Tracks. Today, Arnaud Morillon, Baptiste

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The Age of AI Demands Faster Chip Development: Only Arm and Cadence Deliver

This blog post was originally published at Arm’s website. It is reprinted here with the permission of Arm. Strategic collaboration accelerates Custom Silicon for evolving AI workloads As AI continues its rapid evolution, optimized silicon is crucial to unlock next-generation applications. Arm serves as a foundation for this innovation with its CPU, GPU and related

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D3 Announces Production-intent mmWave Radar Kit Based on Texas Instruments Radar Sensor

Based on Texas Instruments mmWave radar technology, the DesignCore® RS-2944A mmWave Radar Sensor features a single board, small form factor, and an easy-to-use USB-serial interface. Rochester, NY – December 19, 2023 – D3, announced their DesignCore® RS-2944A mmWave Radar Sensor Evaluation Kit based on TI’s AWR2944 radar sensor. The DesignCore Evaluation Kit enables the implementation

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What’s In the Box? Chinese Automotive LiDARs At a Glance

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Seyond and Robosense LiDARs use different 2D scan technologies. Both systems display a complex assembly. Twice a month, Yole SystemPlus analysts share the noteworthy points from their Automotive Teardown Tracks. Today, Morgan

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