Brian Dipert

Understanding USB 3.2 vs. USB 3.1 vs. 3.0: What Are Their Differences?

Blog Posts, e-con Systems, Sensors and Cameras /

This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Knowing the differences between USB 3.2, USB 3.1, and USB 3.0 helps equip the right application with the right camera interface. Discover what differentiates these powerful interfaces from each other to make the right choice. […]

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“Better Farming through Embedded AI,” a Presentation from Blue River Technology

Algorithms, Edge AI and Vision Alliance, Industrial Vision (Computer Vision), Memory, Object Identification, Object Tracking, Processors, Robotics, Sensors and Cameras, Software, Summit 2024, Tools, Videos /

Chris Padwick, Director of Computer Vision Machine Learning at Blue River Technology, presents the “Better Farming through Embedded AI” tutorial at the May 2024 Embedded Vision Summit. Blue River Technology, a subsidiary of John Deere, uses computer vision and deep learning to build intelligent machines that help farmers grow more food more efficiently. By enabling

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SiMa.ai Expands ONE Platform for Edge AI with MLSoC Modalix, a New Product Family for Generative AI

Multimodal, News, Processors, SiMa.ai, Tools /

Industry’s first multi-modal, software-centric edge AI platform supports any edge AI model from CNNs to multi-modal GenAI and everything in between with scalable performance per watt SAN JOSE, Calif.–(BUSINESS WIRE)–SiMa.ai, the software-centric, embedded edge machine learning system-on-chip (MLSoC) company, today announced MLSoC™ Modalix, the industry’s first multi-modal edge AI product family. SiMa.ai MLSoC Modalix supports

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NVIDIA AI Workbench Simplifies Using GPUs on Windows

Algorithms, Blog Posts, NVIDIA, Processors, Software, Tools /

This blog post was originally published at NVIDIA’s website. It is reprinted here with the permission of NVIDIA. NVIDIA AI Workbench is a free, user-friendly development environment manager that streamlines data science, ML, and AI projects on your system of choice: PC, workstation, datacenter, or cloud. You can develop, test, and prototype projects locally on

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“Unveiling the Power of Multimodal Large Language Models: Revolutionizing Perceptual AI,” a Presentation from BenchSci

Algorithms, Edge AI and Vision Alliance, Multimodal, Software, Summit 2024, Tools, Videos /

István Fehérvári, Director of Data and ML at BenchSci, presents the “Unveiling the Power of Multimodal Large Language Models: Revolutionizing Perceptual AI” tutorial at the May 2024 Embedded Vision Summit. Multimodal large language models represent a transformative breakthrough in artificial intelligence, blending the power of natural language processing with visual understanding. In this talk, Fehérvári

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The Advanced IC Substrate Industry: Exciting Developments On the Horizon

Market Analysis, Memory, Processors, Yole Group /

This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. Substrate manufacturers are expanding their capacities to support advanced packaging growth, with new entrants joining the market. OUTLINE The advanced IC substrate market is expected to have a CAGR 24-29 of 9%

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IDTechEx Company Profile: Ambarella

Algorithms, Ambarella, Automotive, Market Analysis, Processors, Security, Sensors and Cameras, Software, Tools /

This market research report was originally published at Ambarella’s website. It is reprinted here with the permission of Ambarella. Note: This article was originally published on the IDTechEx subscription platform. It is reprinted here with the permission of IDTechEx – the full profile including SWOT analysis and the IDTechEx index is available as part of

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“Making Alexa More Ambiently Intelligent with Computer Vision,” a Presentation from Amazon

Algorithms, Edge AI and Vision Alliance, Entertainment, Memory, Processors, Sensors and Cameras, Software, Summit 2024, Tools, Videos /

Michael Giannangeli, Senior Manager of Product Management for Alexa Devices at Amazon, presents the “Making Alexa More Ambiently Intelligent with Computer Vision,” tutorial at the May 2024 Embedded Vision Summit. This presentation takes a behind-the-scenes look at the development and launch of adaptive content on Alexa Devices, which uses computer vision to adjust the on-screen

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2.5D and 3D – IDTechEx Explores Advanced Semiconductor Packaging

Market Analysis, Memory, Processors /

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx’s report, “Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications“, goes into detail about emerging technologies, including 2.5D and 3D packaging. The level up While 1D and 2D semiconductor technologies continue to dominate many applications, the

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Enhancing Face Detection Through Noise Reduction: A Breakthrough in Visual Recognition

Algorithms, Blog Posts, Face Detection, Sensors and Cameras, Software, Tools, Visidon /

This blog post was originally published at Visidon’s website. It is reprinted here with the permission of Visidon. In the ever-evolving landscape of security technology, the accuracy of face detection plays a pivotal role in safeguarding our surroundings. However, the accuracy and efficiency of face detection algorithms can be significantly challenged, especially in low-light conditions

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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