On February 18, 2026, at 9:00 am PST (12:00 pm EST), and on February 19, 2026 at 11:00 am CET, Alliance Member company e-con Systems in partnership with onsemi will deliver a webinar “Enabling Reliable Industrial 3D Vision with iToF Technology” From the event page: Join e-con Systems and onsemi for an exclusive joint webinar […]
Upcoming Webinar on Industrial 3D Vision with iToF Technology Read More +
This blog post was originally published at BrainChip’s website. It is reprinted here with the permission of BrainChip. We all know the AI revolution train is heading straight for the Embedded Station. Some of us are already in the driver’s seat, while others are waiting for the first movers to pave the way so we can
Right Sizing AI for Embedded Applications Read More +
This blog post was originally published at Peridio’s website. It is reprinted here with the permission of Peridio. The gap between robotics prototypes and production deployments has always been an infrastructure problem disguised as a hardware problem. Teams build incredible computer vision models and robotic control systems on NVIDIA Jetson developer kits, only to hit
This blog post was originally published at e-con Systems’ website. It is reprinted here with the permission of e-con Systems. Key Takeaways How the idea of near-miss incidents shapes proactive traffic safety programs Where near-miss detection strengthens future-ready intersections and highways How AI vision tracks movement, classifies conflict, and ranks severity Why imaging features such as
Proactive Road Safety: Detecting Near-Miss Incidents with AI Vision Read More +
On February 25, 2026 from 8:30 am to 5:30 pm ET, Advantech, Qualcomm, Arrow, in partnership with D3 Embedded, Edge Impulse, and the Pittsburgh Robotics Network will present Robotics Builders Forum, an in-person conference for engineers and product teams. Qualcomm and D3 Embedded are members of the Edge AI and Vision Alliance, while Edge Impulse
Robotics Builders Forum offers Hardware, Know-How and Networking to Developers Read More +
OpenMV kicked off 2026 with a substantial software update and a clearer look at where the platform is headed next. The headline is OpenMV Firmware v4.8.1 paired with OpenMV IDE v4.8.1, which adds multi-sensor capabilities, expands event-camera support, and lays the groundwork for a major debugging and connectivity upgrade coming with firmware v5. If you’re
OpenMV’s Latest: Firmware v4.8.1, Multi-sensor Vision, Faster Debug, and What’s Next Read More +
Key Takeaways: NanoXplore’s NG-ULTRA FPGA becomes the first product qualified to new European ESCC 9030 standard for space applications The product leverages a supply chain fully based in the European Union, from design to manufacturing and test, and delivered by ST Its advanced digital capability enables European customers to develop higher performance, more competitive satellites
NanoXplore and STMicroelectronics Deliver European FPGA for Space Missions Read More +
This article was originally published at Analog Devices’ website. It is reprinted here with the permission of Analog Devices. Training robots in the physical world is slow, expensive, and difficult to scale. Roboticists developing AI policies depend on high quality data—especially for complex tasks like picking up flexible objects or navigating cluttered environments. These tasks rely
Faster Sensor Simulation for Robotics Training with Machine Learning Surrogates Read More +
Voyager v1.5.3 dropped, and Ultralytics YOLO26 support is the big headline here. If you’ve been following Ultralytics’ releases, you’ll know Ultralytics YOLO26 is specifically engineered for edge devices like Axelera’s Metis hardware. Why Ultralytics YOLO26 matters for your projects: The architecture is designed end-to-end, which means no more NMS (non-maximum suppression) post-processing. That translates to simpler deployment and
Voyager SDK v1.5.3 is Live, and That Means Ultralytics YOLO26 Support Read More +
On January 29, 2026, at 9:00 am PST (12:00 pm EST) Alliance Member company e-con Systems will deliver a webinar “Challenges of Depth of Field (DoF) in Macro Imaging” From the event page: We’re excited to invite you to an exclusive webinar hosted by e-con Systems: Challenges of DoF in Macro Imaging. In this session,
Upcoming Webinar on Challenges of Depth of Field (DoF) in Macro Imaging Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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