Ettlingen, November 18, 2025 — For a medical imaging project, ADLINK wanted to integrate VC MIPI Cameras with its I-Pi SMARC IMX8M Plus Development Kit. Vision Components adapted the standard driver for the NXP i.MX 8M Plus processor platform to the ADLINK board, including full ISP support, for features such as color tuning etc. As […]
VC MIPI Cameras & ADLINK i.MX 8M Plus: Full Driver Support Read More +
Nov 18, 2025 Geneva, Switzerland STM32WL3R MCUs add flexible features to low-power radio for superior user experiences in consumer electronics and home automation Integrated in new RF remotes from building-automation leader Somfy STMicroelectronics has introduced the STM32WL3R, a wireless microcontroller (MCU) optimized for remote control units in consumer products and home automation. Evolved from the proven STM32WL3
This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The world is increasingly becoming connected, intelligent, and autonomous. At the core of this transformation is Artificial Intelligence (AI), which is swiftly transitioning from the cloud to the edge, nearer to where data is generated and actions are
Trends in Embedded AI: Designing Hardware for Machine Learning on the Edge Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The market research & strategy consulting company, Yole Group, delivers a dual perspective on global semiconductor dynamics and China’s fast-evolving industry landscape. Key Takeaways Global semiconductor device revenues are set to reach
Semiconductor Industry 2025: Worldwide Dynamics and China’s Strategic Rise Unveiled Read More +
This blog post was originally published at Synopsys’s website. It is reprinted here with the permission of Synopsys. As the saying goes, with great risk comes great reward. Because of the profound complexity and intricate dependencies between hardware and software, developing a custom AI chip is one of the most capital-intensive and high-risk endeavors in
10 Tips for First-Pass Silicon Success in AI Chip Development Read More +
On December 17, 2025, at 9:00 am PST (12:00 pm EST), Alliance Member companies e-con Systems, Lattice Semiconductor, and NVIDIA will deliver a joint webinar “Real-Time AI Sensor Fusion with e-con Systems’ Holoscan Camera Solutions using Lattice FPGA for NVIDIA Jetson Thor Platform.” From the event page: Join an exclusive webinar hosted by e-con Systems®,
Upcoming Webinar Explores Real-time AI Sensor Fusion Read More +
This blog post was originally published at Efinix’s website. It is reprinted here with the permission of Efinix. In the rapidly evolving world of microelectronics, there is a relentless push to reduce size and power consumption while increasing compute capability and throughput. Smart edge devices, the internet of things and now Edge AI have only
The Benefits of System-in-Package Read More +
This blog post was originally published at NXP Semiconductors’ website. It is reprinted here with the permission of NXP Semiconductors. Smarter Perception at the Edge Dusty construction sites. Fog-covered fields. Crowded warehouses. Heavy rain. Uneven terrain. What does it take for an autonomous machine to perceive and navigate challenging real-world environments like these – reliably, in
Enabling Autonomous Machines: Advancing 3D Sensor Fusion With Au-Zone Read More +
This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. ChipStack, a leading startup providing agentic AI solutions for chip verification, and Cadence have announced an agreement for ChipStack to join the agentic AI team at Cadence. Founded by technologists with deep expertise in both AI and semiconductor
Cadence Welcomes ChipStack Read More +
This blog post was originally published at Woodside Capital’s website. It is reprinted here with the permission of Woodside Capital. Palo Alto – November 3, 2025 – Woodside Capital Partners (WCP) is pleased to release our Digital Advertising Quarterly Sector Update for Q3 2025, authored by senior bankers Alain Bismuth and George Jones. Introduction: Intelligence on the Edge Edge
AI at the Edge: Low Power, High Stakes Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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