Nov 26, 2025 Seoul, South Korea — Chips&Media is announcing that the next-generation customized NPU, WAVE-N v2, is ready for release, delivering higher computational power along with improved area and power efficiency. WAVE-N v2 is also designed to support a wider range of applications, such as object detection and segmentation, in addition to visual quality enhancement […]
This blog post was originally published at Quadric’s website. It is reprinted here with the permission of Quadric. The term “model zoo” first gained prominence in the world of AI / machine learning beginning in the 2016-2017 timeframe. Originally used to describe open-source public repositories of working AI models – the most prominent of which today
Let’s Visit the Zoo Read More +
This article was originally published at Cadence’s website. It is reprinted here with the permission of Cadence. Cadence has unveiled 10 Verification IP (VIP) for key emerging interfaces tuned for AI-based designs, including Ultra Accelerator Link (UALink), Ultra Ethernet (UEC), LPDDR6, UCIe 3.0, AMBA CHI-H, Embedded USB v2 (eUSB2), and UniPro 3.0. These new VIP will
Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs Read More +
Big update from the Metis world: the epic new 4-core PCIe card is now available to order over on the store. Huge performance shift that opens up seriously scalable edge AI. Key specs: 856 TOPS (INT8) Choice of 16GB and 64GB DRAM ~12,800 FPS on ResNet-50 Runs dozens of streams or parallel models per board
The New Metis PCIe with 4 Quad-Core AIPUs is Here Read More +
This blog post was originally published at HCLTech’s website. It is reprinted here with the permission of HCLTech. Key takeaways AI, mobility and cloud are the growth engines: They’re pushing chips toward a $1 trillion market by 2030 and forcing fabs to invest in sub-3nm nodes and advanced packaging Chips are bigger and more complex: Larger dies and
How Semiconductor Equipment Makers Will Drive the Next $1 Trillion Wave Read More +
Ettlingen, November 18, 2025 — For a medical imaging project, ADLINK wanted to integrate VC MIPI Cameras with its I-Pi SMARC IMX8M Plus Development Kit. Vision Components adapted the standard driver for the NXP i.MX 8M Plus processor platform to the ADLINK board, including full ISP support, for features such as color tuning etc. As
VC MIPI Cameras & ADLINK i.MX 8M Plus: Full Driver Support Read More +
Nov 18, 2025 Geneva, Switzerland STM32WL3R MCUs add flexible features to low-power radio for superior user experiences in consumer electronics and home automation Integrated in new RF remotes from building-automation leader Somfy STMicroelectronics has introduced the STM32WL3R, a wireless microcontroller (MCU) optimized for remote control units in consumer products and home automation. Evolved from the proven STM32WL3
This blog post was originally published at Tessolve’s website. It is reprinted here with the permission of Tessolve. The world is increasingly becoming connected, intelligent, and autonomous. At the core of this transformation is Artificial Intelligence (AI), which is swiftly transitioning from the cloud to the edge, nearer to where data is generated and actions are
Trends in Embedded AI: Designing Hardware for Machine Learning on the Edge Read More +
This market research report was originally published at the Yole Group’s website. It is reprinted here with the permission of the Yole Group. The market research & strategy consulting company, Yole Group, delivers a dual perspective on global semiconductor dynamics and China’s fast-evolving industry landscape. Key Takeaways Global semiconductor device revenues are set to reach
Semiconductor Industry 2025: Worldwide Dynamics and China’s Strategic Rise Unveiled Read More +
This blog post was originally published at Synopsys’s website. It is reprinted here with the permission of Synopsys. As the saying goes, with great risk comes great reward. Because of the profound complexity and intricate dependencies between hardware and software, developing a custom AI chip is one of the most capital-intensive and high-risk endeavors in
10 Tips for First-Pass Silicon Success in AI Chip Development Read More +
Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.
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