Brian Dipert

RealSense Completes Spinout from Intel, Raises $50 Million to Accelerate AI-powered Vision for Robotics and Biometrics

The newly independent company is set to lead in computer vision and machine perception for physical AI and beyond SAN FRANCISCO — July 11, 2025 — RealSense, a pioneer in AI-powered computer vision, today announced its successful spinout from Intel Corporation and the close of a $50 million Series A funding round. With investment led by […]

RealSense Completes Spinout from Intel, Raises $50 Million to Accelerate AI-powered Vision for Robotics and Biometrics Read More +

Comparing Synthetic Data Platforms: Synetic AI and NVIDIA Omniverse

This blog post was originally published at Synetic AI’s website. It is reprinted here with the permission of Synetic AI. This blog post compares Synetic AI and NVIDIA Omniverse for synthetic data generation, focusing on deployment-ready computer vision models. Whether you’re exploring simulation tools or evaluating dataset creation platforms, this guide outlines key differences and

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Lattice Semiconductor Demonstration of NVIDIA Holoscan-compatible Cameras from Valued Partners

Jacob Mercado, Applications Engineer at Lattice Semiconductor, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Mercado demonstrates Holoscan camera solutions from ecosystem partner vendors Leopard Imaging and e-con Systems, designed with Lattice FPGAs for use with NVIDIA Orin AGX or IGX platforms. Holoscan is enabled

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Lattice Semiconductor Demonstration of Random Bin Picking Based on Structured-Light 3D Scanning

Mark Hoopes, Senior Director of Industrial and Automotive at Lattice Semiconductor, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Hoopes demonstrates how Lattice FPGAs increase performance, reduce latency and jitter, and reduce overall power for a random bin picking robot. The Lattice FPGA offloads the

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Upcoming Tech Talk Explores How to Solve Tomorrow’s AI Problems Today with Edge Co-processors

Next Tuesday, July 15, 2025 at 8:00 am PT (11:00 am ET), Alliance Member company Cadence will deliver the free tech talk “Solving Tomorrow’s AI Problems Today with Cadence’s Newest Processor.” From the event page: The AI industry is undergoing a profound transformation, with evolving workloads demanding processors that deliver unparalleled efficiency, flexibility, and performance.

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Andes Technology’s AutoOpTune Applies Genetic Algorithms to Accelerate RISC-V Software Optimization

Andes AutoOpTune™ v1.0 accelerates software development by giving software developers the ability to automatically explore and choose the compiler optimizations to achieve their performance and code-size targets. Hsinchu, Taiwan – July 10, 2025 – Andes Technology, a leading provider of high-efficiency, low-power 32/64-bit RISC-V processor cores and a Founding Premier member of RISC-V International, today

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Stereo ace for Precise 3D Images Even with Challenging Surfaces

The new high-resolution Basler Stereo ace complements Basler’s 3D product range with an easy-to-integrate series of active stereo cameras that are particularly suitable for logistics and factory automation. Ahrensburg, July 10, 2025 – Basler AG introduces the new active 3D stereo camera series Basler Stereo ace consisting of 6 camera models and thus strengthens its position as

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Optimizing Your AI Model for the Edge

This blog post was originally published at Qualcomm’s website. It is reprinted here with the permission of Qualcomm. Key takeaways: We talk about five techniques—compiling to machine code, quantization, weight pruning, domain-specific fine-tuning, and training small models with larger models—that can be used to improve on-device AI model performance. Whether you think edge AI is

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Cadence Demonstration of Waveguide 4D Radar Central Computing on a Tensilica Vision DSP-based Platform

Sriram Kalluri, Product Marketing Manager for Cadence Tensilica DSPs, demonstrates the company’s latest edge AI and vision technologies and products at the 2025 Embedded Vision Summit. Specifically, Kalluri demonstrates the use of the Tensilica Vision 130 (P6) DSP for advanced 4D radar computing for perception sensing used in ADAS applications. The Vision 130 DSP is

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Cadence Demonstration of a SWIN Shifted Window Vision Transform on a Tensilica Vision DSP-based Platform

Amol Borkar, Director of Product Marketing for Cadence Tensilica DSPs, presents the company’s latest edge AI and vision technologies at the 2025 Embedded Vision Summit. Specifically, Borkar demonstrates the use of the Tensilica Vision 230 (Q7) DSP for advanced AI and transformer applications. The Vision 230 DSP is a highly efficient, configurable, and extensible processor

Cadence Demonstration of a SWIN Shifted Window Vision Transform on a Tensilica Vision DSP-based Platform Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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