Ceva

“NPU IP Hardware Shaped Through Software and Use-case Analysis,” a Presentation from Ceva

Yair Siegel, Senior Director for Wireless and Emerging Markets at Ceva, presents the “NPU IP Hardware Shaped Through Software and Use-case Analysis” tutorial at the May 2025 Embedded Vision Summit. True innovation in tiny machine learning (tinyML) emerges from a synergy between software ingenuity, real-world application insights and leading-edge processor… “NPU IP Hardware Shaped Through […]

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Embedded Quest 2025: MCU Vendors Step up Edge AI Play

Edge AI was the primary focus of microcontroller vendors at the 2025 Embedded World Exhibition. We caught up with some industry executives for our annual Embedded Quest program, asking them about their take on Edge AI. As usual, the Embedded World Exhibition in Nuremberg, Germany, drew a large crowd of companies in the computing processor

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Ceva-NeuPro-Nano Wins Product of the Year Award at Prestigious EE Awards Asia Event

Extending its Smart Edge IP leadership, Ceva-NeuPro-Nano™ received the Best IP/Processor of the year Ceva-NeuPro-Nano NPUs deliver optimal balance of ultra-low power and best performance in small area to efficiently execute embedded AI workloads in consumer, industrial and general-purpose AIoT products ROCKVILLE, MD., December 5, 2024 – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of

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Alliance Members at 2025 CES

The Edge AI and Vision Alliance 2025 CES Directory for game-changing computer vision and AI technologies Many Alliance Member companies will be showing off the latest building-block technologies that enable new capabilities for machines that see! CES is huge so we’ve created a handy checklist of these companies and where to find them including how

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Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications

Partnership enables AI developers to train, optimize and deploy embedded ML models on the Ceva-NeuPro-Nano NPU IP, pre-silicon, via Edge Impulse Platform ROCKVILLE, Md., Sept. 24, 2024 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and

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Ceva Wins Prestigious OFweek China Automotive Industry Award 2024

Ceva-Waves UWB low power ultra-wideband IP named a winner of the Cabin-Driving Integrated Technology Breakthrough Award in China ROCKVILLE, MD., August 28, 2024 – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, announced today that its

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Upcoming Webinar Explores How AI Can Make Cameras See In the Dark

On September 10, 2024 at 9:00 am PT (noon ET), Alliance Member companies Ceva and Visionary.ai will deliver the free webinar “Can AI Make Cameras See In the Dark? Real-Time Video Enhancement.” From the event page: As cameras become ubiquitous in applications such as surveillance, mobile, drones, and automotive systems, achieving clear vision 24/7 under

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Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere

Ceva-NeuPro-Nano NPUs deliver optimal balance of ultra-low power and best performance in small area to efficiently execute TinyML workloads in consumer, industrial and general-purpose AIoT products Ceva-NeuPro Studio complete AI SDK for the Ceva-NeuPro NPU family supports open AI frameworks including TensorFlow Lite for Microcontrollers and microTVM to simplify the rapid development of TinyML enabled

Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere Read More +

Oriented FAST and Rotated BRIEF (ORB) Feature Detection Speeds Up Visual SLAM

This blog post was originally published at Ceva’s website. It is reprinted here with the permission of Ceva. In the realm of smart edge devices, signal processing and AI inferencing are intertwined. Sensing can require intense computation to filter out the most significant data for inferencing. Algorithms for simultaneous localization and mapping (SLAM), a type

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Partitioning Strategies to Optimize AI Inference for Multi-core Platforms

This blog post was originally published at Ceva’s website. It is reprinted here with the permission of Ceva. Not so long ago, AI inference at the edge was a novelty easily supported by a single NPU IP accelerator embedded in the edge device. Expectations have accelerated rapidly since then. Now we want embedded AI inference

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Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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Berkeley Design Technology, Inc.
PO Box #4446
Walnut Creek, CA 94596

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Phone: +1 (925) 954-1411
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